At present, laser processing technology has been widely used in semiconductor fields such as microelectronics and photovoltaic. It has the advantages of high processing accuracy, small thermal effect, fast processing speed, high efficiency and no selectivity to materials. When laser processing technology is applied to solar efficient cells, it can significantly simplify the battery preparation process, and improve the production efficiency and product yield. With the development of laser technology and the improvement of application requirements, it is very important to find the location of laser beam gathering point quickly and accurately during laser debugging. If the laser is in defocus mode for processing, it will cause the laser light energy loss during processing, reduce processing efficiency, waste processing cost, and even affect the processing effect, resulting in an unpredictable impact on the product. The utility model relates to a laser focus positioning device, which comprises a detector for receiving the pulse emitted by the green laser pointer and imaging; A carrying platform located below the detector is used to support the detector; The position adjustment mechanism is located on both sides of the carrying platform and is connected with the carrying platform, and the position adjustment mechanism is used to adjust the lifting of the carrying platform; An optical attenuator located above the detector for attenuating the laser pulse; And the image acquisition and analysis module, and the detector communication connection.
Negative focal length (the cutting focus is on the cutting material) is mainly used when cutting thick metal plates. Negative focal length cutting thick plate needs high powered laser cutting amplitude, lead to the nozzle to transport insufficient oxygen and make the cutting temperature drop, the cutting surface is relatively rough, not suitable for high precision precision cutting. Focal length (the cutting focus is on the surface of the cutting material) is usually a focus positioning method for cutting SS41, SPH, SPC and other materials. 0 focal length cutting focus is close to the workpiece surface, due to the cutting surface of the upper and lower smoothness is not the same, so when cutting the upper surface of the cutting is relatively smooth, and the lower surface is relatively rough. This way of cutting focus positioning needs to be based on the actual situation of the upper and lower surface process requirements. Focus position definition: focus to cut the workpiece on the surface of the distance, the focus position above the workpiece is generally called positive focus, focus position below the workpiece is generally called negative focus.