200mw Laser Skin Removal
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Laser marking greatly reduces microcracks and microcracks in wafers, and the distance between LEDs is closer, which improves productivity and productivity. Generally speaking, more than 20,000 LED monolithic devices can be separated from a 2-inch wafer, so the cutting width will significantly affect the number of particles; reducing microcracks will significantly improve the long-term reliability of the separated LED devices. Compared with traditional blade cutting, laser marking not only improves the output efficiency, but also improves the processing speed, avoiding the machining defects and cost losses caused by blade wear. In a word, laser processing has high precision, large tolerance and low cost.