Heat dissipation method of high output laser pointer

At present, the main heat dissipation methods of laser pointers are divided into traditional heat dissipation methods and new heat dissipation methods. Traditional heat dissipation methods include: air cooling, semiconductor heat dissipation, natural convection heat dissipation, etc., and new heat dissipation methods include flip chip heat dissipation and microchannel heat dissipation. The heat dissipation performance of high-power semiconductor laser pointers is mainly evaluated by thermal resistance and heat flux. Attention should be paid to the heat flux at the limit temperature during evaluation. If the temperature difference between the two is found to be large during heat dissipation analysis, condensation will appear on the surface of the laser chip. After this problem occurs, in addition to affecting the optical output power, it will also affect the wavelength lock, even because of the junction. Exposure problems will destroy the photoelectric performance of the circuit and ultimately affect the reliability. At present, the common method to reduce thermal resistance is to use thermally conductive materials. The emergence of thermally conductive materials provides more optimization space for the laser pointer to lower the temperature.